Packaging Of Optoelectronic Multichip Modules
Agency / Branch:
DOD / DARPA
Future systems will require high-speed optical interconnection of computers in networks and of devices with in a computer at the backplane level. These optical interconnections will require hybrid packaging of optical, electronic, and optoelectronic devices in optoelectronic multichip modules (OEMCMs). Major challenges in OEMCMs involve achieving optical interconnection of various devices within the OEMCM, and specifically achieving low coupling losses through mode matching and very precise positioning of devices. We propose development of OEMCMs based on the use of a silicon substrate for mounting of all devices, and offer these innovations: (1) use of planar tapered waveguides to achieve mode matching complex connectivity (e.g., optical signal splitting and combining) between devices within the OEMCM, (2) novel structures for combining planar tapered waveguides with semiconductor devices, and (3) advanced structures and techniques for mounting the various devices to the substrate. We will examine performance, manufacturing issues, and process compatibility of all components. The proposed innovations will allow the development of OEMCMs with passive positioning of all devices, which are manufacturable at low cost with high yield and realiability. These OEMSMs will be applicable to a wide variety of communications and computing systems. ANTICIPATED BENEFITS: The proposed innovations will allow the development of OEMCMs with passive positioning of all devices, which are manufacturable at low cost with high yield and realiability. These OEMCMs will be applicable to a wide variety of communications and computing systems.
Small Business Information at Submission:
Principal Investigator:Robert Kalman
4009 Miranda Avenue Palo Alto, CA 94304
Number of Employees: