USA flag logo/image

An Official Website of the United States Government

Packaging Of Optoelectronic Multichip Modules

Award Information

Agency:
Department of Defense
Branch:
Defense Advanced Research Projects Agency
Award ID:
19733
Program Year/Program:
1995 / SBIR
Agency Tracking Number:
19733
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Optical Networks Inc
3450 Hillview Ave Palo Alto, CA 94304
View profile »
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 2
Fiscal Year: 1995
Title: Packaging Of Optoelectronic Multichip Modules
Agency / Branch: DOD / DARPA
Contract: N/A
Award Amount: $379,312.00
 

Abstract:

Future systems will require high-speed optical interconnection of computers in networks and of devices with in a computer at the backplane level. These optical interconnections will require hybrid packaging of optical, electronic, and optoelectronic devices in optoelectronic multichip modules (OEMCMs). Major challenges in OEMCMs involve achieving optical interconnection of various devices within the OEMCM, and specifically achieving low coupling losses through mode matching and very precise positioning of devices. We propose development of OEMCMs based on the use of a silicon substrate for mounting of all devices, and offer these innovations: (1) use of planar tapered waveguides to achieve mode matching complex connectivity (e.g., optical signal splitting and combining) between devices within the OEMCM, (2) novel structures for combining planar tapered waveguides with semiconductor devices, and (3) advanced structures and techniques for mounting the various devices to the substrate. We will examine performance, manufacturing issues, and process compatibility of all components. The proposed innovations will allow the development of OEMCMs with passive positioning of all devices, which are manufacturable at low cost with high yield and realiability. These OEMSMs will be applicable to a wide variety of communications and computing systems. ANTICIPATED BENEFITS: The proposed innovations will allow the development of OEMCMs with passive positioning of all devices, which are manufacturable at low cost with high yield and realiability. These OEMCMs will be applicable to a wide variety of communications and computing systems.

Principal Investigator:

Robert Kalman
4158550200

Business Contact:

Small Business Information at Submission:

Optivision, Inc.
4009 Miranda Avenue Palo Alto, CA 94304

EIN/Tax ID:
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No