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Company Information:

Company Name: Ormet Circuits, Inc.
City: Carlsbad
State: CA
Zip+4: 92008
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
Website URL: N/A
Phone: (760) 931-7096

Award Totals:

Program/Phase Award Amount ($) Number of Awards
SBIR Phase I $876,178.00 12
SBIR Phase II $4,684,717.00 7
STTR Phase I $136,031.00 2

Award List:

High Strength Soldering Compounds Produced from Gas Atomized Powered Metal Alloys

Award Year / Program / Phase: 1992 / SBIR / Phase I
Agency / Branch: DOD / MDA
Principal Investigator: Kevin Christiam
Award Amount: $49,600.00

High Strength Soldering Compounds Produced from Gas Atomized Powered Metal Alloys

Award Year / Program / Phase: 1993 / SBIR / Phase II
Agency / Branch: DOD / MDA
Principal Investigator: Kevin Christiam
Award Amount: $500,000.00
Abstract:
Sn-Pb solder alloys used now to solder electronics fail from fatigue cracking. Attempts involving new binary and ternary alloys have increased strengths less than 10% over current solders. No substitute exists with higher mechanical strength yet melting below 210 degrees Celsius, compatible with… More

ENVIRONMENTALLY STABLE EMBEDDED COMPONENTS FOR SEVERE ENVIRONMENT MULTICHIP MODULES

Award Year / Program / Phase: 1994 / SBIR / Phase I
Agency / Branch: DOD / MDA
Principal Investigator: Michael Todd
Award Amount: $54,423.00

Process for the Environmentally Friendly Fabrication of Multilayer Printed Circuit Boards

Award Year / Program / Phase: 1994 / SBIR / Phase I
Agency / Branch: DOD / DARPA
Principal Investigator: Pradeep Gandhi
Award Amount: $108,035.00

High Strength Flexible Adhesives for Environmentally Demanding Rigid-Flex Circuitry

Award Year / Program / Phase: 1994 / SBIR / Phase I
Agency / Branch: DOD / USAF
Principal Investigator: Michael Todd
Award Amount: $79,930.00

Enabling Photosensitive Polymer Technology for Additive MCM-L

Award Year / Program / Phase: 1995 / SBIR / Phase I
Agency / Branch: DOD / MDA
Principal Investigator: Catherine Gallagher
Award Amount: $62,938.00
Abstract:
Phase I will develop a novel photosensitive polymer dielectric which would allow MCM-Ls to be produced reliably, and with high yields through a sequential multilayer additive process. This material would be developed from novel polymer precursors which have demonstrated the positive attributes of… More

Thermal Management in Electronics Packaging Using Metal Substrates

Award Year / Program / Phase: 1995 / SBIR / Phase I
Agency / Branch: DOD / MDA
Principal Investigator: Goran Matijasevic, Ph.d.
Award Amount: $63,419.00
Abstract:
There exists a growing need for electronic packaging that is capable of good thermal management. Better thermal dissipation can be achieved with the use of insulated metal boards at a fraction of the cost. Despite this, the high thermal conductivity of the metal substrate has not been taken full… More

Process for the Environmentally Friendly Fabrication of Multilayer Printed Circuit Boards

Award Year / Program / Phase: 1995 / SBIR / Phase II
Agency / Branch: DOD / DARPA
Principal Investigator: Pradeep Gandhi
Award Amount: $768,119.00
Abstract:
The treatment of the waste by-products of electronics manufacturing is raising increasingly important issues. Of particular concern is contaminated waste water resulting from the stripping, etching, plating, and washing operations in printed circuit board fabrication. Waste treatment has proven to… More

ENVIRONMENTALLY STABLE EMBEDDED COMPONENTS FOR SEVERE ENVIRONMENT MULTICHIP MODULES

Award Year / Program / Phase: 1996 / SBIR / Phase II
Agency / Branch: DOD / MDA
Principal Investigator: Michael Todd
Award Amount: $1,554,538.00
Abstract:
The objective of Phase I will be to fabricate resistors, capacitors, and inductors using these materials and do some preliminary environmental testing on them. Phase II objective would be to demonstrate repeatable, high quality formation of the buried components that will be based on current… More

High Strength Flexible Adhesives for Environmentally Demanding Rigid-Flex Circuitry

Award Year / Program / Phase: 1996 / SBIR / Phase II
Agency / Branch: DOD / USAF
Principal Investigator: Michael Todd
Award Amount: $373,564.00
Abstract:
Rigid-flex printed circuits consist of a rigid and flexible electrical laminates sandwiched together to form a composite structure having both rigidity and flexibility. They are attractive for commercial and military high performance applications because size and weight is reduced while reliability… More

Fabrication and Assembly of High Operating Temperature Circuits

Award Year / Program / Phase: 1996 / SBIR / Phase I
Agency / Branch: DOD / DARPA
Principal Investigator: Goran Matijasevic
Award Amount: $99,000.00
Abstract:
There is a trend towards an architecture that uses digital data buses to transfer information between control system components. The hurdle to distributed control architecture is that it moves components from benign into harsh environments. A major challenge is the need for operation at… More

Flat Panel Displays Based on Light-Emitting Electrochemical Cells

Award Year / Program / Phase: 1996 / SBIR / Phase II
Agency / Branch: DOD / DARPA
Principal Investigator: Catherine Gallagher , Principal Investigator
Award Amount: $375,472.00

New Low-Cost, High Performance Approach to EMI Shielding at the Circuit Board Level

Award Year / Program / Phase: 1997 / SBIR / Phase I
Agency / Branch: DOD / ARMY
Principal Investigator: Lutz Brandt
Award Amount: $95,539.00
Abstract:
High speed electronics suffer from an increased vulnerability regarding electromagnetic interference. The problem is even more acerbated by an environment of extreme electromagnetic pollution. Wide band shielding against electromagnetic interference is therefore crucial if reliability of… More

New Low-Cost, High Performance Approach to EMI Shielding at the Circuit Board Level

Award Year / Program / Phase: 1998 / SBIR / Phase II
Agency / Branch: DOD / ARMY
Principal Investigator: Lutz Brandt
Award Amount: $763,000.00
Abstract:
High speed electronics suffer from an increased vulnerability regarding electromagnetic interference. The problem is even more acerbated by an environment of extreme electromagnetic pollution. Wide band shielding against electromagnetic interference is therefore crucial if reliability of… More

Compact, High Performance Thermelectric Modules for Thermal Management of Electronic Packaging

Award Year / Program / Phase: 1998 / SBIR / Phase I
Agency / Branch: DOD / MDA
Principal Investigator: Xiaomei Xi
Award Amount: $64,892.00
Abstract:
As electronic devices become smaller, faster and more complex, their need for high heat dissipation turns into a pressing concern. Cumbersome cooling systems such as large heat sinks, forced air cooling and fluid cooling are impractical and need to be replaced by alternative, small size, light… More

Integration of Passive Components into Organic MCM Packages

Award Year / Program / Phase: 1999 / SBIR / Phase I
Agency / Branch: DOD / USAF
Principal Investigator: Lutz Brandt
Award Amount: $99,003.00

Self-Cooled, Highly Integrated Area Array IC Chip Carrier

Award Year / Program / Phase: 1999 / STTR / Phase I
Agency / Branch: DOD / NAVY
Research Institution: University of California
Principal Investigator: Xiaomei Xi
Award Amount: $69,890.00
RI Contact: N/A

N/A

Award Year / Program / Phase: 2000 / SBIR / Phase I
Agency / Branch: DOD / MDA
Principal Investigator: Xiaomei Xi
Award Amount: $0.00

N/A

Award Year / Program / Phase: 2000 / SBIR / Phase II
Agency / Branch: DOD / MDA
Principal Investigator: Xiaomei Xi
Award Amount: $350,024.00

Compact, Polymer-Based IC Package with Integrated Passives and Active Cooling

Award Year / Program / Phase: 2002 / STTR / Phase I
Agency / Branch: DOD / MDA
Research Institution: University of California, Irvine
Principal Investigator: Dan Baxter, V.P. of Engineering
Award Amount: $66,141.00
RI Contact: Chin C. Lee
Abstract:
"Development of a polymer-based semiconductor chip package integrated with embedded passives and active cooling is proposed. Integration will increase overall system performance, reduce the PWB real estate consumed in support of each chip, as well as reduceassembly costs and improve reliability. OCI… More

Lead-free Solder Alternative Interconnect Material

Award Year / Program / Phase: 2010 / SBIR / Phase I
Agency / Branch: DOD / USAF
Principal Investigator: Catherine Shearer, Senior Scientist
Award Amount: $99,399.00
Abstract:
The elimination of lead from most electronic assembly applications has had a number of repercussions. The low temperature alternatives suffer from detrimental performance and cost limitations. The high tin alloys have high process temperatures and a tendency to form tin whiskers, both of which have… More