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High Temperature Superconductor Quick Disconnect

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N00014-06-M-0364
Agency Tracking Number: N062-158-0048
Amount: $99,902.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N06-158
Solicitation Number: 2006.2
Timeline
Solicitation Year: 2006
Award Year: 2006
Award Start Date (Proposal Award Date): 2006-09-29
Award End Date (Contract End Date): 2007-06-29
Small Business Information
P.O. Box 71
Hanover, NH 03755
United States
DUNS: 072021041
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Anthony Dietz
 Engineer
 (603) 643-3800
 ajd@creare.com
Business Contact
 James Barry
Title: Contracts Director
Phone: (603) 643-3800
Email: contractsmgr@creare.com
Research Institution
N/A
Abstract

Superconducting degaussing, propulsion and power systems offer potential weight, size and performance advantages over conventional systems. High temperature superconductors enable superconducting operation at higher temperatures, reducing the size and complexity of the cooling system. Many of the required technologies for these systems are commercially available. However, new connector technology is required for such systems to be viable in the operation environment of a Navy ship, where routine maintenance and rapid damage repair will necessitate the disconnection and replacement of system components. Creare proposes a High Temperature Superconductor Quick Disconnect (HTSQD), which combines a demountable HTS joint with minimal electrical resistance with Creare’s proven and patented U-Guard cryogenic seal. Our design goals are to minimize electrical resistance, minimize heat leak, and maximize operability, reliability and maintainability. Furthermore, the connector design will be guided by a system-level analysis. In Phase I we will prepare a preliminary design of the HTSQD and we will demonstrate its feasibility through tests and analyses. In Phase II we will fabricate a prototype connector and measure its performance.

* Information listed above is at the time of submission. *

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