Ultra-High Heat Flux Condenser for Electronics Coo
Agency / Branch:
DOD / OSD
Temperature control systems for high-power electronics in future military platforms will need two-phase cooling systems, either in the form of two-phase pumped loops or vapor compression refrigeration systems. Either type of system will require a compact condenser to reject heat. We propose to develop an innovative heat exchanger that couples an extremely compact, microchannel condenser with a very-high heat flux, single-phase heat exchanger. The technology enables very low thermal resistance and uses only well-established, low-cost fabrication processes and can be adapted to a wide range of sizes and form factors. In Phase I we proved the feasibility of our approach by defining a complete set of specifications for the condenser, designing and building a proof-of-concept condenser, and demonstrating heat transfer coefficients greater than 50,000 W/my-oC under prototypical operating conditions. In Phase II we will develop original design analyses and test data needed to design full size, two-phase, microchannel heat exchangers. We will then design, build, and demonstrate a full-scale prototype to reject 5 kW of heat from a two-phase loop operating at 70oC to a fresh water cooling loop at a temperature of 25oC.
Small Business Information at Submission:
Michael G. Izenson
P.O. Box 71 Hanover, NH 03755
Number of Employees: