Fiscal Year:
1989
Title:
HIGH THERMAL CONDUCTIVITY ELECTRONIC SUBSTRATE
Agency / Branch:
DOD / USAF
Contract:
N/A
Award Amount:
$49,874.00
Abstract:
WE PROPOSE TO INITIATE DEVELOPMENT OF A HIGH THERMAL CONDUCTIVITY PRINTED CIRCUIT BOARD (PCB) ASSEMBLY. USE OF A HEAT PIPE TECHNIQUE IS EXPECTED TO YIELD THERMAL CONDUCTIVITIES MANY TIMES THAT OF COPPER OR EXPENSIVE CERAMICS. THE PRINCIPLES OF HEAT PIPE OPERATION ARE DISCUSSED, AND A SIMPLE PRINTED CIRCUIT BOARD CONSTRUCTION IS PROPOSED TO TAKE ADVANTAGE OF THOSE PRINCIPLES. USE OF THIS TECHNIQUE PROMISES TO ELIMINATE DISCREET HEAT SINKS IN MANY APPLICATIONS. PHASE I WORK WILL DEMONSTRATE THE FEASIBILITY OF A HEAT PIPE/PRINTED CIRCUIT BOARD HYBRID. A COMPUTER MODEL WILL BE DEVELOPED AND USED TO OPTIMIZE THE DESIGN OF A PROTOTYPE. PROTOTYPE DEVICES TO BE FABRICATED AND TESTED IN PHASE II WORK WILL USE AVAILABLE MATERIALS AND CONSTRUCTION TECHNIQUES. THESE DEVICES WILL BE TESTED TO DETERMINE THEIR OPERATING LIMITS.
Principal Investigator:
Bob L Mackey
6194565476
Business Contact:
Small Business Information at Submission:
Physical Dynamics Inc
Po Box 1883 La Jolla, CA 92038
EIN/Tax ID:
DUNS:
N/A
Number of Employees:
Woman-Owned:
No
Minority-Owned:
No
HUBZone-Owned:
No