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A POLYMER BASED OPTICAL DATA BUS FOR HIGHLY PARALLEL SYSTEMWIDE COMMUNICATIONS

Award Information
Agency: Department of Energy
Branch: N/A
Contract: N/A
Agency Tracking Number: 14564
Amount: $49,963.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 1991
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
20600 Gramercy Place Suite 103
Torrance, CA 90501
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Dr Ray Chen
 Principal Investigator
 () -
Business Contact
Phone: (213) 320-3088
Research Institution
N/A
Abstract

THIS PROJECT STUDIES THE DEVELOPMENT OF A POLYMER-BASED OPTICAL DATA BUS (ODB) FOR HIGH SPEED SYSTEMWIDE INTERCONNECTIONS FOR USE IN HIGH ENERGY PHYSICS DATA PROCESSING AND DETECTOR INSTRUMENTATION. THE CONCEPT PROVIDES AN ODB COMPATIBLE WITH WIDELY USED MODULE INTERCONNECTION STANDARDS (E.G., CAMAC, FASTBUS, VMEBUS) WHILE IMPROVING COMMUNICATION SPEED AND PARALLELISM. BOTH SEGMENT AND GLOBAL INTERCONNECTIONS BASED ON THE PLANNED TECHNOLOGY CAN BE REALIZED. THE USE OF A HIGH SPEED POLYMER-BASED ODB FOR CHIP-TO-CHIP, INTRAMODULE, AND MODULE-TO-MODULE INTERCONNECTION IS BEING STUDIED. THE TWO-DIMENSIONAL TUNABILIITY OF THE REFRACTIVE INDEX OF THE POLYMER MICROSTRUCTURE PROVIDES THE CAPABILITY TO MAKE A MICROSTRUCTURED CHANNEL WAVEGUIDE ON ANY SUBSTRATE OF INTEREST. THIS CHARACTERISTIC PROVIDES AN EASY MEANS OF CONSTRUCTING OPTICAL BACKPLANES AND PRINTED ODB BOARDS FOR SYSTEMWIDE COMMUNICATION. FURTHERMORE, THE HOST MATERIAL CAN BE USED TO INTRODUCE A NONLINEAR OPTICAL MOIETY IN A GUEST/HOST POLYMER SYSTEM FOR THE HIGHLY PARALLEL PROCESSING NEEDED FOR FASTBUS INTERCONNECTIONS. THE POLYMERODB SHOULD BE IMMUNE TO ELECTROMAGNETIC INTERFERENCE AND NUCLEAR RADIATION. THE PHASE I RESEARCH IS ATTEMPTING TO DEMONSTRATE A BOARD-TO-BOARD ODB SYSTEM THROUGH A BACKPLANE. THE SYSTEM WILL HAVE SPEED AND COMMUNICATION DISTANCES BEYOND ANY CONVENTIONAL ELECTRONIC SYSTEMWIDE INTERCONNECTIONS.

* Information listed above is at the time of submission. *

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