You are here

sbir/sttr phase i: Innovative Materials for Thermal Management

Award Information
Agency: National Science Foundation
Branch: N/A
Contract: N/A
Agency Tracking Number: 0215327
Amount: $98,144.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 2002
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
9960 Glenoaks Blvd, unit A
Sun Valley, CA 91352
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Dean Baker
 (818) 768-6420
 powdermet@earthlink.net
Business Contact
Phone: () -
Research Institution
N/A
Abstract

This Small Business Innovation Research Phase I project will enable a 2-fold increase in conductivity for products without sacrificing power or capability. Recently, a new high thermal conductivity material has been produced using CVD fluid bed coating process and low cost consolidation techniques. The realization of improved electronic substrates is dependent on the increases in thermal conductivity over standard materials. Though high conductivity materials have been identified, consolidating these materials in a cost effective and durable manner has remained illusive. The encapsulation of materials prior to consolidation has aided the durability and low cost processing. The innovation in this program is to improve the encapsulated materials being produced, and potentially develop even greater and distinctly different physical properties additional development of the encapsulated powder/consolidation process is necessary. This Small Business Innovation Research Phase I project will enable a 2-fold increase in conductivity for products without sacrificing power or capability. Recently, a new high thermal conductivity material has been produced using CVD fluid bed coating process and low cost consolidation techniques. The realization of improved electronic substrates is dependent on the increases in thermal conductivity over standard materials. Though high conductivity materials have been identified, consolidating these materials in a cost effective and durable manner has remained illusive. The encapsulation of materials prior to consolidation has aided the durability and low cost processing. The innovation in this program is to improve the encapsulated materials being produced, and potentially develop even greater and distinctly different physical properties additional development of the encapsulated powder/consolidation process is necessary.

* Information listed above is at the time of submission. *

US Flag An Official Website of the United States Government