Hierarchical CAD Tools for Radiation Hardened Mixed Signal Electronic Circuits
Agency / Branch:
DOD / DARPA
Currently available RF/Mixed Signal design kits and tools do not provide the necessary precision to accurately predict integrated circuit performance when exposed to total ionization dose (TID), single event effects (SEE) and prompt dose (PD) environments.Specifically, the parametric variation of key performance indicators (KPI) is not accounted for at the device modeling, circuit and system levels.Current engineering practices use adhoc and unpredictable methods to converge on a product KPIÂ¿Â¿s. This adhoc method is generally referred to as Â¿silicon bread boardingÂ¿
Small Business Information at Submission:
RIDGETOP GROUP, INC.
7070 North Oracle Road, Suite 120 Tucson, AZ 85704
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