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Conformable Multichip Assembly Technology

Award Information

Department of Defense
Air Force
Award ID:
Program Year/Program:
1997 / SBIR
Agency Tracking Number:
Solicitation Year:
Solicitation Topic Code:
Solicitation Number:
Small Business Information
Woman-Owned: No
Minority-Owned: Yes
HUBZone-Owned: No
Phase 1
Fiscal Year: 1997
Title: Conformable Multichip Assembly Technology
Agency / Branch: DOD / USAF
Contract: N/A
Award Amount: $99,799.00


EPIC Technologies proposes to develop a flexible high density multichip assembly technology capable of being bent and twisted to conform to the available space in a constrained military of commercial electronic system. EPIC will adapt its basic chips first multichip assembly technology to meet the requirements of a conformable assembly. EPIC's basic chip first technology has been previously developed and is now being used to produce fieldable portable systems. The technology comprises a high density additive printed circuit technology applied to a substrate containing bare integrated circuit chips. The main goal of the Phase I effort is to demonstrate the feasibility of the conformable technology by producing a prototype. This prototype will consist of existing passive chips which can be connected into daisy chains in the conformable assembly. Prototypes will be designed, fabricated, tested, subjected to bending and torsional stress and retested to confirm the reliability of the connections.A second goal of the Phase I effort is to identify military and commercial applications of the conformable technology. This will be accomplished by reviewing the forthcoming capability with government and commercial entities during Phase I.

Principal Investigator:

Charles W. Eichelberger

Business Contact:

Small Business Information at Submission:

Scientific Systems Company
500 West Cummings Park Suite 300 Woburn, MA 01801

Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No