Low-Power, Monolithically Printed, Conformal, Sensors and Associated Microelectronics
Agency / Branch:
DOD / DARPA
SI2 Technologies, Inc. (SI2) proposes the use of high mobility (>10 cm2/(V s)) organic semiconductors to enable printable, low-power flexible sensors and microelectronics with the compactness and low weight that is essential for manned and unmanned aerialvehicle (UAV) electronic system integration. SI2's Direct Write technology and high mobility conductive polymers enable the proposed sensor systems and will offer a significant cost reduction over the existing paradigm. By reducing the cost of electronicdevices and using large area flexible substrates, it is possible to distribute the electronics over the entire surface of a vehicle and provide an additional saving of space over conventionally packaged electronic devices. The proposed low powermicroelectronic system will increase the mission capability of a number of military platforms such as UAV's. The ability to cost effectively embed and integrate microelectronics will provide additional capabilities with minimal space, weight and powerrequirements. Additionally, the ability to fabricate inexpensive sensors conformal with vehicle surfaces could greatly increase the ease of which chemical and biological agents can be detected. This ability could have a wide range of applicationincluding homeland defense. This technology also has potential in the commercial sector for a embedded sensors, logic and communications systems where cost, space, weight and power are constrained.
Small Business Information at Submission:
200 Turnpike Road Chelmsford, MA 01824
Number of Employees: