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Flexible T/R Modules for Large-Aperture, Space-Based SAR

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNC06CA20C
Agency Tracking Number: 040321
Amount: $599,993.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: E1.05
Solicitation Number: N/A
Timeline
Solicitation Year: 2004
Award Year: 2006
Award Start Date (Proposal Award Date): 2005-12-07
Award End Date (Contract End Date): 2007-12-06
Small Business Information
200 Turnpike Road
Chelmsford, MA 01824-4000
United States
DUNS: 13164091
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Erik Handy
 Principal Investigator
 (978) 606-2601
 ehandy@si2technologies.com
Business Contact
 Joseph Kunze
Title: Business Official
Phone: (978) 606-2601
Email: nsawyer@si2technologies.com
Research Institution
N/A
Abstract

There is a need for electronically-steerable, space-deployable SAR antenna arrays which impose minimal weight burden on the vehicles that place them into orbit. SAR arrays may be several tens to hundreds of meters long in at least one dimension, necessitating their assembly from many smaller subarrays. However, suitable technologies for manufacturing T/R modules directly on even these smaller (albeit still large-area), flexible subarrays have been lacking, hindering development of space-based arrays. SI2 Technologies' innovation is to apply its Direct Write techniques to fabricating flexible T/R modules that can be integrated with each array element. The novelty of SI2's Direct Write manufacturing approach is that no tooling, masks, or harsh etchants are required. SI2's "printing" technology lends itself to any number of applications that require flexible antenna systems (e.g., earth science, military asset tracking, civilian communications, etc.). For the proposed Phase II program, SI2 will design and fabricate chipless T/R modules for a membrane SAR antenna array using Direct Write manufacturing processes.

* Information listed above is at the time of submission. *

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