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A Reliable Aluminum Nitride High Temperature Electronic Package for High Power…

Award Information

Agency:
Department of Defense
Branch:
Army
Award ID:
78569
Program Year/Program:
2006 / SBIR
Agency Tracking Number:
A052-140-3695
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Sienna Technologies, Inc.
19501 144TH AVE NE SUITE F-500 Woodinville, WA 98072-4423
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Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 1
Fiscal Year: 2006
Title: A Reliable Aluminum Nitride High Temperature Electronic Package for High Power Devices
Agency / Branch: DOD / ARMY
Contract: W31P4Q-06-C-0153
Award Amount: $120,000.00
 

Abstract:

This Small Business Innovation Research Phase I project will develop an AlN ceramic package that will facilitate the operation of high power SiC devices at temperatures greater than 300ºC. Processes to assemble the components into a hermetically sealed package will be identified and developed. We will develop a novel die attach to overcome thermal stress failures, and a robust monometallic gold wire bonding capable of reliable operation above 300ºC possibly up to 600ºC. Test vehicles will be fabricated and used to evaluate the high temperature stability of the material systems to be used in the package construction.

Principal Investigator:

Ender Savrun
President
4254857272
ender.savrun@siennatech.com

Business Contact:

Canan Savrun
Vice President
4254857272
canan.savrun@siennatech.com
Small Business Information at Submission:

SIENNA TECHNOLOGIES, INC.
19501 144th Avenue NE, Suite F-500 Woodinville, WA 98072

EIN/Tax ID: 911724179
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No