A Reliable Electronic Package for Space Exploration
The proposed program will develop an hermetic, CTE matched, thermal shock resistant ceramic packaging technology that will facilitate the operation of Si and SiGe devices at extreme temperatures (-230Ã½Ã½C to 130Ã½Ã½C) encountered on the Moon and Mars. Processes to assemble the components into a hermetically sealed package will be identified and developed. Process and materials capability will be demonstrated by fabricating and testing a 12 or 28 pin single chip module test vehicle.
Small Business Information at Submission:
Sienna Technologies, Inc.
19501 144th Avenue NE, Suite F-500 Woodinville, WA 98072
Number of Employees: