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Company Information:

Company Name:
Silicon Connection Inc.
Address:
493 E 6th St - Ste A
Tracy, CA 95376
Phone:
N/A
URL:
N/A
EIN:
N/A
DUNS:
N/A
Number of Employees:
12
Woman-Owned?:
No
Minority-Owned?:
No
HUBZone-Owned?:
No

Commercialization:

Has been acquired/merged with?:
N/A
Has had Spin-off?:
N/A
Has Had IPO?:
N/A
Year of IPO:
N/A
Has Patents?:
N/A
Number of Patents:
N/A
Total Sales to Date $:
$ 0.00
Total Investment to Date $
$ 0.00
POC Title:
N/A
POC Name:
N/A
POC Phone:
N/A
POC Email:
N/A
Narrative:
N/A

Award Totals:

Program/Phase Award Amount ($) Number of Awards
SBIR Phase I $144,767.00 3
SBIR Phase II $494,000.00 1

Award List:

THIS PROPOSAL DESCRIBES THE EVOLUTION OF A NEW ARCHITECTURE FOR THE CREATION OF ADVANCED ELECTRONIC SYSTEMS.

Award Year / Program / Phase:
1985 / SBIR / Phase I
Award Amount:
$47,959.00
Agency / Branch:
DOD / NAVY
Principal Investigator:
Jon m schroeder
Abstract:
This proposal describes the evolution of a new architecture for the creation of advanced electronic systems. the concept involves the use of conducting and semiconducting organic polymers, which are treated by process, just as integrated silicon, to form a three dimensional, fine pitched,… More

CONDUCTIVE POLYMERS

Award Year / Program / Phase:
1986 / SBIR / Phase I
Award Amount:
$47,959.00
Agency / Branch:
DOD / DARPA
Principal Investigator:
Jon m schroeder
Abstract:
This proposal describes the evolution of a new architecture for the creation of advanced electronic systems. the concept involves the use of conducting and semiconducting organic polymers, which are treated by process, just as integrated silicon, to form a three dimensional, fine pitched,… More

ADVANCED PACKAGING ASSEMBLY FOR VLSI DEVICES

Award Year / Program / Phase:
1986 / SBIR / Phase I
Award Amount:
$48,849.00
Agency / Branch:
DOD / NAVY
Principal Investigator:
Jon M Schroeder
Abstract:
N/a

ADVANCED PACKAGING ASSEMBLY FOR VLSI DEVICES

Award Year / Program / Phase:
1987 / SBIR / Phase II
Award Amount:
$494,000.00
Agency / Branch:
DOD / NAVY
Principal Investigator:
Jon M Schroeder
Abstract:
Presently there are many problems with the available in the market. this research project proposes a vlsi packaging system which can provide enhanced thermal management because of the use of sputtered aluminum nitride, copper clad invar core material in the substrate and tab technology. the… More