Award Year / Program / Phase:
2002 / STTR / Phase I
Agency / Branch:
DOD / MDA
Research Institution:
University of Florida
Award Amount:
$70,000.00
RI Contact:
Steve Pearton
Abstract:
Sinmat Inc. working with University of Florida, proposes to develop an economical and scalable process for fabrication of diamond light emitting diodes (LEDs) that operate in the deep ultraviolet regime. These LEDs are expected to have significant usage inBMDO related activities as compact sources…
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Award Year / Program / Phase:
2005 / STTR / Phase I
Agency / Branch:
DOD / MDA
Research Institution:
UNIV. OF FLORIDA
Award Amount:
$99,999.00
RI Contact:
Rajiv Singh
Abstract:
Presently one of the outstanding challenges for rapid commercialization of SiC based device technology for high power/high frequency electronics is the affordable, volume production of damage-free, epi-ready 100 mm SiC wafers that exhibit single atomic steps (terraces). Sinmat Inc. in partnership…
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Award Year / Program / Phase:
2006 / STTR / Phase II
Agency / Branch:
DOD / MDA
Research Institution:
UNIV. OF FLORIDA
Award Amount:
$750,000.00
RI Contact:
Roslyn Oleson
Abstract:
Currently one of the outstanding challenges is the affordable, volume production of epi-ready, 100 mm SiC wafers that are scratch-free and have atomic-scale surface finish. As SiC is relatively chemically inert and mechanically hard, aggressive polishing methods involving very hard particles have…
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Award Year / Program / Phase:
2010 / STTR / Phase I
Agency / Branch:
DOD / MDA
Research Institution:
University of Florida
Award Amount:
$100,000.00
RI Contact:
Rajiv K. Singh
Abstract:
Gallium Nitride (GaN) substrates are ideal materials for fabrication of high-power and high-frequency devices based on III-V materials. The current state-of-the-art Chemical Mechanical Polishing (CMP) methods are plagued by several challenges, including, surface charge affects due to surface…
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Award Year / Program / Phase:
2010 / SBIR / Phase II
Agency / Branch:
DOD / MDA
Award Amount:
$799,994.00
Abstract:
The overall goal of the Phase II effort is to develop the novel ultra-rapid chemical mechanical finishing (UCMF) process for SiC mirror manufacturing, and commercialize this process in collaboration with existing vendors using existing equipment infrastructure. Unlike glass and metallic systems, the…
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