SBIR Phase I: Nanoporous Silica Slurry Technology for Enhanced Chemical Mechanical Planarization (CMP) of Low "k" Dielectrics
The Small Business Innovation Research (SBIR) Phase I project will synthesize novel
slurries for chemical mechanical planarization (CMP) of low dielectric constant (K)
materials. Standard abrasives such as silica and alumina lead to significant scratching,
indenting and delamination of the soft low K surface. In this project it is proposed to use
nanoporous silica based slurries in which the hardness of the particle can be controlled.
In the project, synthesis of nanoporous silica particles will first be carried out followed by charcterization; next will be development of the slurry formulation followed by charcterization and finally testing against the specific needs of the CMP application.
Commercially, these slurries are expected to reduce surface defects and enhance slurry stability. It is expected that major electronic manufacturing companies will use this new type of slurry. Wafer level experiments are already planned on patterned wafers in
collaboration with key industrial partners.
Small Business Information at Submission:
Principal Investigator:Deepika Singh
2153 Hawthorne Rd Gainesville, FL 32641
Number of Employees: