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SBIR Phase I: Abraisve Free Chemical Mechanical Planarization (AFCMP) Process…

Award Information

Agency:
National Science Foundation
Branch:
N/A
Award ID:
84770
Program Year/Program:
2007 / SBIR
Agency Tracking Number:
0712037
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Sinmat Inc
1912 NW 67th Place GAINESVILLE, FL -
View profile »
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 1
Fiscal Year: 2007
Title: SBIR Phase I: Abraisve Free Chemical Mechanical Planarization (AFCMP) Process for Next Generation Copper Interconnects
Agency: NSF
Contract: 0712037
Award Amount: $100,000.00
 

Abstract:

This small business innovation research (SBIR) Phase I project proposes the development of a novel abrasive-free recyclable copper CMP (AFCMP) recyclable process based on an unique patented iodine chemistry which leads to the formation of a soft, insoluble copper iodide layer on the surface of the copper. This layer can be gently removed by the polishing pad without the need for particles in the slurry (abrasive-free slurry). This process is in contrast to conventional CMP processes that forms a hard copper oxide layer (by addition of hydrogen peroxide), which require both etching chemicals and hard abrasives (alumina/silica) for removal. In contrast, the copper iodide layer possess nearly an order of magnitude less hardness, thus can be easily removed by the polymer polishing pad. The insoluble copper-iodide in the effluents can be removed by filtration and the chemicals can be recycled back for CMP polishing. This project will attempt successful demonstration of (i) copper polishing using abrasive-free CMP slurries to meet present technical requirements, (ii) compatibility of AFCMP slurries to next generation ultra-low k dielectrics materials, (iii) the ability to filter and obtain consistent performances with the filtrate slurries. The rapid integration of low k interconnects and AFCMP is expected to lead to substantial profits and energy savings. Environmental friendly manufacturing, and increase in hi-tech jobs. US will be a leader in copper low k CMP technology; and US based semiconductor companies will have a local slurry supplier. Ensure US leadership in nanotechnology.

Principal Investigator:

Abhudaya A. Mishra
PhD
3523347237
amishra@sinmat.com

Business Contact:

Abhudaya A. Mishra
PhD
3523347237
amishra@sinmat.com
Small Business Information at Submission:

SINMAT, INC.
2153 SE HAWTHORNE RD STE 129 Suite 190 GAINESVILLE, FL 32641

EIN/Tax ID: 593645729
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No