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CMOS Compatible Active Silicon Nanophotonic Devices and Systems

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA9550-05-C-0166
Agency Tracking Number: F045-013-0141
Amount: $750,000.00
Phase: Phase II
Program: STTR
Solicitation Topic Code: AF04-T013
Solicitation Number: N/A
Timeline
Solicitation Year: 2004
Award Year: 2005
Award Start Date (Proposal Award Date): 2005-08-19
Award End Date (Contract End Date): 2007-08-19
Small Business Information
201 Circle Drive North, Unit # 102
Piscataway, NJ 08854
United States
DUNS: 787144807
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Brent Hoerman
 Scientist
 (732) 302-9274
 bhoerman@structuredmaterials.com
Business Contact
 Gary Tompa
Title: President
Phone: (732) 302-9274
Email: gstompa@structuredmaterials.com
Research Institution
 CORNELL UNIV.
 Mora Harris
 
117 Day Hall
Ithica, NY 14853
United States

 (607) 255-1050
 Nonprofit College or University
Abstract

In this STTR effort, Structured Materials Industries, Inc. (SMI), in collaboration with our academic and industrial partners will design, develop, and demonstrate a more efficient and compact, silicon optical modulator based on nanoscale photonic structures that is completely compatible with standard CMOS processing. The structures developed will form the building blocks for a family of devices based on active silicon nanophotonics which will open the door to a new technology free from conventional microelectronics limitations, providing low power, high bandwidth, high speed and ultra-small optoelectronic components. Moreover, the active silicon nanophotonic devices to be developed will benefit from the inherent infrastructure and cost benefits of the existing CMOS manufacturing infrastructure. In Phase I of this project, we expanded preliminary results on specific electro-optic devices to address a more general class of devices and their integration on a silicon chip within a commercially manufacturable infrastructure. In this Phase II effort we will complete development of the devices and finalize a route for integrating passive and active components into complex, electro-optical systems on a single silicon chip within a commercial CMOS foundry.

* Information listed above is at the time of submission. *

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