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SBIR/STTR Phase I:Multimodal High-Conductivity Filler for Epoxy Molding…

Award Information

Agency:
National Science Foundation
Branch:
N/A
Award ID:
58578
Program Year/Program:
2002 / SBIR
Agency Tracking Number:
0215224
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
SOMMER MATERIALS RESEARCH, INC.
587 North Main Street North Salt Lake, UT 84054-2101
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Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 1
Fiscal Year: 2002
Title: SBIR/STTR Phase I:Multimodal High-Conductivity Filler for Epoxy Molding Compounds
Agency: NSF
Contract: N/A
Award Amount: $99,987.00
 

Abstract:

This Small Business Innovation Research (SBIR) Phase I Project will investigate the feasibility of incorporating diamond powder in epoxy molding compounds at high packing densities using optimized multi-modal distributions of diamond powder. The resulting thermalconductivities of these composite encapsulants are expected to be higher than 100 W/mK. Selection of semiconductor molding compounds that exhibit high thermal conductivity are crucial in dissipating heat generated by high-power electronic components, particularly as feature sizes of future chips decrease in size. Most epoxy molding compounds used to encapsulate semiconductors contain fused silica (55-70% by volume) to maintain a compatible thermal expansion coefficient and impart moisture resistance. However, the resulting thermal conductivities of the composite compounds are very low (<3 W/mK). By loading commercial molding epoxies with optimized diamond powder distributions, diamond volume fractions above 65% may be obtained in the epoxy molding liquid with a viscosity compatible with commercial molding processes. The diamond/epoxy molding compound will serve as a upper-limit benchmark material for thermal conductivity and will be used in high-performance microelectronic packaging applications where heat dissipation is critical.

Principal Investigator:

Jared Sommer
8016315500
jsommer@alum.mit.edu

Business Contact:

Small Business Information at Submission:

Sommer Materials Research
640 North Main North Salt Lake, UT 84054

EIN/Tax ID:
DUNS: N/A
Number of Employees: N/A
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No