Fiscal Year:
1991
Title:
DEVELOPMENT OF NOVEL CURING TECHNIQUES FOR THERMOSETTING POLYMERS AND ADHESIVES
Agency / Branch:
DOD / ARMY
Contract:
N/A
Award Amount:
$298,776.00
Abstract:
THE MAIN OBJECTIVE OF THIS PROGRAM IS TO DETERMINE THE FEASIBILITY OF DEVELOPING A THERMOSETTING POLYMERIC ADHESIVE AND CURING METHOD THAT WILL NOT REQUIRE CURE CYCLES IN AN OVEN OR A PRESS AT ELEVATED TEMPERATURES AND PRESSURES. THE PROGRAM WILL ENCOMPASS A STUDY OF THE RESPONSIVENESS OF THERMOSETTING EPOXY ADHESIVES TO DIELECTRIC, INDUCTION, ULTRASONIC, ULTRE-VIOLET, AND INFRARED ELECTROMAGNETIC ENERGIES. ENERGY SENSITIZERS WILL BE INVESTIGATED FOR IMPROVING THE ADHESIVE'S RESPONSIVENESS TOWARDS ENERGIES SHOWING LIMITED EFFECTS. A FINAL EVALUATION OF THE PHYSICAL PROPERTIES RELATING TO THE CURE OF THE ADHESIVE WILL BE USED TO DETERMINE FEASIBILITY OF DEVELOPING A NOVE CURING THERMOSETTING POLYMERIC ADHESIVE.
Principal Investigator:
Dr Bernard Baum
2037498371
Business Contact:
Small Business Information at Submission:
Springborn Materials Science
10 Springborn Ctr Enfield, CT 06082
EIN/Tax ID:
DUNS:
N/A
Number of Employees:
Woman-Owned:
No
Minority-Owned:
No
HUBZone-Owned:
No