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Company Information:

Company Name:
Stress Photonics, Inc.
Address:
3002 Progress Road
Madison, WI 53716
Phone:
(608) 224-1230
URL:
N/A
EIN:
N/A
DUNS:
N/A
Number of Employees:
5
Woman-Owned?:
No
Minority-Owned?:
No
HUBZone-Owned?:
No

Commercialization:

Has been acquired/merged with?:
N/A
Has had Spin-off?:
N/A
Has Had IPO?:
N/A
Year of IPO:
N/A
Has Patents?:
N/A
Number of Patents:
N/A
Total Sales to Date $:
$ 0.00
Total Investment to Date $
$ 0.00
POC Title:
N/A
POC Name:
N/A
POC Phone:
N/A
POC Email:
N/A
Narrative:
N/A

Award Totals:

Program/Phase Award Amount ($) Number of Awards
SBIR Phase I $251,956.00 4
SBIR Phase II $974,899.00 3
STTR Phase I $95,393.00 1
STTR Phase II $494,436.00 1

Award List:

THERMOGRAPHIC NON-DESTRUCTIVE EVALUATION

Award Year / Program / Phase:
1990 / SBIR / Phase I
Award Amount:
$49,622.00
Agency / Branch:
DOD / NAVY
Principal Investigator:
Dr Neal F Enke
Abstract:
The proposal is to establish quantitative thermographic non-destructive evaluation (qtnde) for nondestructive inspection and defect evaluation of fracture-critical advanced aircraft materials. this will be based on recent theoretical and experimental advances concerning the adiabatic thermoelastic… More

THERMOGRAPHIC STRESS ANALYSIS/NDE VIA FOCAL PLANE ARRAY DETECTORS

Award Year / Program / Phase:
1991 / SBIR / Phase I
Award Amount:
$49,000.00
Agency:
NASA
Principal Investigator:
Abstract:
N/a

THERMOGRAPHIC STRESS ANALYSIS/NDE VIA FOCAL PLANE ARRAY DETECTORS

Award Year / Program / Phase:
1992 / SBIR / Phase II
Award Amount:
$372,943.00
Agency:
NASA
Principal Investigator:
Abstract:
This innovation will advance the state of the art and practical capabilities of thermographic stress analysis (tsa) and nondestructive evaluation (nde) to investigate andpredict the mechanical behaviors of models and real structures. a benchmarking method will be established to optimize stress… More

Differential Thermography for Extreme Environment Structural Integrity Measurement

Award Year / Program / Phase:
1993 / SBIR / Phase I
Award Amount:
$53,334.00
Agency / Branch:
DOD / USAF
Principal Investigator:
John R. Lesniak
Abstract:
N/a

Differential Thermography for Extreme Environment Structural Integrity Measurement

Award Year / Program / Phase:
1994 / SBIR / Phase II
Award Amount:
$102,000.00
Agency / Branch:
DOD / USAF
Principal Investigator:
John R. Lesniak
Abstract:
Advanced aircraft designs require technology improvements that incorporate the use of advanced materials and material systems for high specific stiffness and temperature capabilities. Improved crack detection and material property measurement techniques are required to support the development and… More

Fatigue Crack Detection Via Differential Thermography

Award Year / Program / Phase:
1995 / SBIR / Phase I
Award Amount:
$100,000.00
Agency:
DOT
Principal Investigator:
Abstract:
N/a

Fatigue Crack Detection Via Differential Thermography

Award Year / Program / Phase:
1996 / SBIR / Phase II
Award Amount:
$499,956.00
Agency:
DOT
Principal Investigator:
Abstract:
N/a

STTR Phase I: Rapid, Nondestructive Residual Stress Characterization of Semiconductor Materials

Award Year / Program / Phase:
2003 / STTR / Phase I
Award Amount:
$95,393.00
Agency:
NSF
Principal Investigator:
Jon Lesniak
Research Institution:
Case Western Reserve
RI Contact:
N/A
Abstract:
This Small Business Technology Transfer (STTR) Phase I project will develop a catalytic process for the generation of hydrogen and/or hydrocarbon fuel gases from biomass. The project will generate fuel gases by reactions of oxygenated hydrocarbons derived from carbohydrates (biomass) with liquid… More

STTR Phae II: Rapid Nondestructive Residual Stress Characterization of Semiconductor Materials

Award Year / Program / Phase:
2005 / STTR / Phase II
Award Amount:
$494,436.00
Agency:
NSF
Principal Investigator:
Research Institution:
Univ. of IL-Urgana-Champaign
RI Contact:
Thomas J. Mackin
Abstract:
This Small Business Technology Transfer (STTR) Phase II research project aims to introduce a series of instruments to the microelectronics industry that allow rapid, high resolution residual stress inspection, defect location and quantification. In silicon wafer manufacture, small cracks may appear… More