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Company Information:

Company Name:
SURFX TECHNOLOGIES LLC
Address:
3617 Hayden Avenue
Culver City, CA 90232
Phone:
(310) 804-2135
URL:
N/A
EIN:
954742361
DUNS:
5065664
Number of Employees:
6
Woman-Owned?:
No
Minority-Owned?:
No
HUBZone-Owned?:
No

Commercialization:

Has been acquired/merged with?:
N/A
Has had Spin-off?:
N/A
Has Had IPO?:
N/A
Year of IPO:
N/A
Has Patents?:
N/A
Number of Patents:
N/A
Total Sales to Date $:
$ 0.00
Total Investment to Date $
$ 0.00
POC Title:
N/A
POC Name:
N/A
POC Phone:
N/A
POC Email:
N/A
Narrative:
N/A

Award Totals:

Program/Phase Award Amount ($) Number of Awards
SBIR Phase I $361,778.00 5
SBIR Phase II $1,249,998.00 2

Award List:

Low-Cost GaN Plasma Enhanced Chemical Vapor Deposition System

Award Year / Program / Phase:
2001 / SBIR / Phase I
Award Amount:
$62,600.00
Agency / Branch:
DOD / MDA
Principal Investigator:
Steve Babayan, President
Abstract:
Wide bandgap III/V nitrides, including GaN, InGaN and AlGaN, are emerging as important materials for solid-state lasers, high-electron-mobility transistors (HEMTs) and millimeter wave integrated circuits. These components serve critical functions inradar, sensors and communication systems used in… More

Plasma Vapor Analyzer for Characterizing Uranium and Plutonium Contamination in the Field

Award Year / Program / Phase:
2002 / SBIR / Phase I
Award Amount:
$99,978.00
Agency:
DOE
Principal Investigator:
Abstract:
70133 The decommissioning and decontamination of nuclear weapons production facilities is an expensive and time-consuming operation. One of the most challenging tasks is identifying the location of plutonium and uranium contamination within a given facility. Physical samples must be… More

SBIR/STTR Phase I: Environmentally Benign, High-Pressure Plasma Cleaning Tool for Photoresists

Award Year / Program / Phase:
2002 / SBIR / Phase I
Award Amount:
$99,200.00
Agency:
NSF
Principal Investigator:
Abstract:
This Small Business Innovation Research (SBIR) Phase I project will establish the performance of the Plasma Flow Source for stripping and residue cleaning of photoresists on 200 mm semiconductor wafers without producing any environmentally-damaging waste streams. In particular, it will determine the… More

SBIR Phase II: Environmentally Benign, High-Pressure Plasma Cleaning Tool for Photoresists

Award Year / Program / Phase:
2003 / SBIR / Phase II
Award Amount:
$499,999.00
Agency:
NSF
Principal Investigator:
Steven Babayan
Abstract:
This SBIR Phase II project focuses on the development of a cleaning tool for the removal of tenacious organic residues from 200 mm wafers. These residues arise from ion bombardment of the photoresist films during processing. Organic residue removal encompasses approximately half of the cleaning… More

SBIR Phase II: Environmentally Benign, High-Pressure Plasma Cleaning Tool for Photoresists

Award Year / Program / Phase:
2003 / SBIR / Phase I
Award Amount:
$0.00
Agency:
NSF
Principal Investigator:
Steven Babayan
Abstract:
This SBIR Phase II project focuses on the development of a cleaning tool for the removal of tenacious organic residues from 200 mm wafers. These residues arise from ion bombardment of the photoresist films during processing. Organic residue removal encompasses approximately half of the cleaning… More

Environmentally Friendly, On-Aircraft Repair of Polyetheretherketone (PEEK) Thermoplastic Components

Award Year / Program / Phase:
2004 / SBIR / Phase I
Award Amount:
$100,000.00
Agency / Branch:
DOD / USAF
Principal Investigator:
Abstract:
An environmentally friendly, on-aircraft repair process for poly-ether-ether-ketone (PEEK) composite materials is proposed. This process takes advantage of a new atmospheric pressure plasma technology for activating the PEEK surface prior to bonding. The plasma is generated in a rugged handheld… More

Environmentally Friendly, On-Aircraft Repair of Polyetheretherketone (PEEK) Thermoplastic Components

Award Year / Program / Phase:
2005 / SBIR / Phase II
Award Amount:
$749,999.00
Agency / Branch:
DOD / USAF
Principal Investigator:
Steven Babayan, President
Abstract:
It has been demonstrated that the Atomflo handheld plasma tool may be used to activate polyetheretherketone composites for adhesive bonding. After a 30-second oxygen plasma treatment, the lap-shear strength of PEEK laminates bonded with AF-563 adhesive ranged from 5000+/-300 psi in double notch… More