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Conductive Grid Application to Hemispherical Optical Components

Award Information
Agency: Department of Defense
Branch: Army
Contract: W31P4Q-09-C-0078
Agency Tracking Number: A082-035-1752
Amount: $70,000.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: A08-035
Solicitation Number: 2008.2
Timeline
Solicitation Year: 2008
Award Year: 2008
Award Start Date (Proposal Award Date): 2008-11-17
Award End Date (Contract End Date): 2009-05-17
Small Business Information
31 B Street
Burlington, MA 01803
United States
DUNS: 150685642
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Thomas Mroz
 Director, Spinel Ceramics
 (716) 875-4091
 TMroz@Surmet.com
Business Contact
 Santosh Jha
Title: R&D Administrator
Phone: (781) 345-5721
Email: SJha@Surmet.com
Research Institution
N/A
Abstract

Transparent domes for multimode seeker technology are currently being developed. Part of that development involves the integration of a fine metal grid for EMI shielding. The shape of the parent dome and the specific requirements for the width and spacing of the grid lines significantly limit the available methods for fabrication. Photolithography has been successfully utilized to produce this grid, however, other processing options with greater flexibility, lower cost, and better manufacturability are sought. We propose herein to develop a direct write grid application method, suitable to achieve the electrical requirements of the application, as well as the down-stream processing routes currently under development. The proposed method will overcome prior issues by providing the opportunities of a wide conductor material choice, as well as variable line thickness capability. Our proposed efforts build on prior and current experience with photolithography, laser methods, and direct write methods that have been, or are being evaluated for this application. Gridded coupons and partial domes will be demonstrated in Phase I. A fully gridded 7” hemispherical dome will be produced by the end of the Phase I Option.

* Information listed above is at the time of submission. *

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