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Polymer and/or Metal Matrix Composite Materials for Thermal Management of Electronic Devices

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N/A
Agency Tracking Number: 18401
Amount: $49,000.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 1992
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
410 Chipeta Way, Suite 222
Salt Lake City, UT 84108
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Mr. Joseph K. Weeks
 (801) 582-8080
Business Contact
Phone: () -
Research Institution
N/A
Abstract

1Heat sinks in the Navy Standard Electronic Module could be improved by increasing the thermal conductivity of the heat sink, decreasing its density and providing a better match between the coefficient of thermal expansion of the heat sink and the electronic circuit boards. Based upon a proprietary fiber coating technology, TRA proposes to investigate the production of copper/graphite composite heat sinks made by liquid metal infiltration. Feasibility of producing a Format D heat sink which incorporates offsets and variations in material thickness will be demonstrated by fabricating a prototype heat sink. The physical and thermal properties of the heat sink will be measured and compared with predicted values. Improved thermal conductivity will be obtained by incorporating highmodulus, high conductivity graphite fibers into the composite.

* Information listed above is at the time of submission. *

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