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Ultra-Dense Three-Dimensional Electronics for Space

Award Information

Agency:
Department of Defense
Branch:
Air Force
Award ID:
86715
Program Year/Program:
2008 / SBIR
Agency Tracking Number:
F073-099-1695
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Tezzaron Semiconductor Corp.
1415 Bond St. #111 Naperville, IL 60563-
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Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 1
Fiscal Year: 2008
Title: Ultra-Dense Three-Dimensional Electronics for Space
Agency / Branch: DOD / USAF
Contract: FA9453-08-M-0020
Award Amount: $100,000.00
 

Abstract:

Tezzaron proposes the development of a 3D integrated memory on processor or host device. The proposed device is made from a very high-performance 3D integrated 512Mb DRAM memory device and a structured array with single layer customization. Both devices in the ultimate 3D integration have a high degree of radiation hardness and also have low power and an ultra-compact form factor.

Principal Investigator:

Robert Patti
CTO
6305050404
rpatti@tezzaron.com

Business Contact:

Sal Burd
CFO
6305050404
sburd@tezzaron.com
Small Business Information at Submission:

TEZZARON SEMICONDUCTOR CORP.
1415 Bond St. #111 Naperville, IL 60563

EIN/Tax ID: 841512428
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No