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Ultra-Dense Three-Dimensional Electronics for Space
- Small Business Information
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Woman-Owned: NoMinority-Owned: NoHUBZone-Owned: No
- Phase 2
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Fiscal Year: 2009Title: Ultra-Dense Three-Dimensional Electronics for SpaceAgency / Branch: DOD / USAFContract: FA9453-09-C-0057Award Amount: $1,579,930.00
Abstract:
Chip-to-chip I/O has become a serious bottleneck, especially in communications between high-speed processors and their memory devices. Integrating a large amount of memory and a powerful processor into a single 3D-IC device could alleviate this problem. Bringing the memory on-chip with a very wide bus and very short vertical interconnects would greatly increase the speed and frequency of I/O between the processor and memory. Designing and optimizing such a device would be a large and expensive undertaking. The proposed program looks to examine the 3D solution in a limited scenario, making minimal changes to an existing memory design and an existing CPU. This will not fully exploit the huge performance benefits of 3D CPU+memory integration, but it will provide a valuable proof-of-concept for future work. BENEFIT: The benefit of this project will be the demostration of technology that will fundamentally change the way compute engines are designed. The provision of large fast memories that function as a direct extension of the data processing silicon has direct commercial application and indeed will enable the next major stride in data processing.Small Business Information at Submission:TEZZARON SEMICONDUCTOR CORP.
1415 Bond St. #111 Naperville, IL 60563EIN/Tax ID: 841512428DUNS: N/ANumber of Employees:Woman-Owned: NoMinority-Owned: NoHUBZone-Owned: No
Award Information
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Agency: Department of Defense |
Branch: Air Force |
Award ID: 86715 |
Program Year/Program: 2009 / SBIR |
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Agency Tracking Number: F073-099-1695 |
Solicitation Year: N/A |
Solicitation Topic Code: N/A |
Solicitation Number: N/A |