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Bandgap Engineered Rad-Hard Multi-Function Digital MMW/Photonic Circuits

Award Information

Agency:
Department of Defense
Branch:
Missile Defense Agency
Award ID:
47623
Program Year/Program:
2004 / SBIR
Agency Tracking Number:
00-1112
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
TLC Precision Wafer Technology, Inc.
1411 West River Road, North Minneapolis, MN 55411-3436
View profile »
Woman-Owned: No
Minority-Owned: Yes
HUBZone-Owned: Yes
 
Phase 2
Fiscal Year: 2004
Title: Bandgap Engineered Rad-Hard Multi-Function Digital MMW/Photonic Circuits
Agency / Branch: DOD / MDA
Contract: DTRA01-02-C-0092
Award Amount: $750,000.00
 

Abstract:

TLC has developed an innovative multi-component radiation hard InP HEMT based chip approach that will provide monolithic digital,millimter-wave and photnic functions for airborne, spaceborne and other military systems. During phase I we demonstrated lattice engineering, epi growth, design and device fabriction capabilities that resulted in high performance electronic and photonic devices using InP based HEMT structures. The electronic and photonic devices were engineered for various frequencies and wavelengths respectively. A transition layer was also demonstrated that will allow multi-devices to be developed and demonstrated on the same epi wafer. Therefore in Phase II, TLC will develop the multi-functio digital/photonic/ MMW circuits simulation, designs, fabrication testing and delivery.

Principal Investigator:

Timothy T. childs
Research Director
6123412795
tim@tlcprecision.com

Business Contact:

Tim Childs
President
6123412795
tlc@tlcprecision.com
Small Business Information at Submission:

TLC PRECISION WAFER TECHNOLOGY, INC.
1411 West River Road North Minneapolis, MN 55411

EIN/Tax ID:
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No