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Inorganic Confromal Coatings for SIC Packaging

Award Information

Department of Defense
Missile Defense Agency
Award ID:
Program Year/Program:
1997 / SBIR
Agency Tracking Number:
Solicitation Year:
Solicitation Topic Code:
Solicitation Number:
Small Business Information
TPL, Inc.
3921 Academy Parkway North, NE Albuquerque, NM 87109-4416
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Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
Phase 2
Fiscal Year: 1997
Title: Inorganic Confromal Coatings for SIC Packaging
Agency / Branch: DOD / MDA
Contract: N/A
Award Amount: $700,000.00


Glass is an attractive material for microelectronic packaging because it is hermetically sealing, has a low coefficient of thermal expansion, and is compatible with d.c. circuits. Unfortunately, the working temperature of glass is too high for this application. Low-temperature processing of a sol-gel derived, aluminosilicate material for hermetic seals is proposed for electronic packaging. This material has 100 times less surface area than similar ceramics, which gives it excellent sealing properties. TPL proposes innovative processing to apply this technology to microelectronic packaging. The sol-gel chemistry and firing conditions will be optimized to make an hermetic coating at low temperatures. The water:alkoxide and solvent:alkoxide ratios will be adjusted to tailor the precursor solution. Methods to produce thick films will be employed to apply this material to electronic packages. TPL has extensive experience and resources in sol-gel technology and helped to develop this aluminosilicate material. The PI is a pioneering researcher in multi-component sol-gel processing.

Principal Investigator:

Douglas J. Taylor

Business Contact:

Small Business Information at Submission:

Tpl, Inc.
3768 Hawkins St., NE Albuquerque, NM 87109

Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No