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Novel Micro-Supercapacitors""
Title: Advanced Scientist
Phone: (505) 344-6744
Email: clakeman@tplinc.com
Title: President & CEO
Phone: (505) 344-6744
Email: hstoller@tplinc.com
"There is a continuing revolution in micro-systems toward increased speed and capability combined with smaller size. As system sizes decrease, the need for power systems of similarly small physical size emerges as a critical need. MEMS batteries areavailable as surface area devices, but their capacity and power delivery capability are limited. Similarly, commercial supercapacitors exist, but these are component-scale devices with a large footprint. Therefore, to realize a comprehensive microscalepower system, a miniaturized supercapacitor that can deliver high power on demand is required.In the proposed effort, TPL will use soft lithography microcontact printing (¿CP), an additive process that can fabricate near-net-shape miniaturized structures from non-silicon materials, to build MEMS-scale supercapacitors for a volumetricelectrochemical energy source. ¿CP will enable micro-supercapacitors to be constructed using optimized materials for a high power-density device. In this way, miniaturization of the highest performance system will be realized.The PI has pioneered the use of soft lithography with non-silicon materials for advanced packaging and has excellent capabilities to achieve the project objectives. TRW Space & Electronics Group will consult on device requirements, design constraints,applications and system engineering to deliver a product suitable for immediate insertion into space and defense applications. Miniaturize
* Information listed above is at the time of submission. *