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Fully Integrated, Single-Chip, Amplified Optical Splitter""

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: DASG60-02-P-0119
Agency Tracking Number: 02-0554
Amount: $69,996.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 2002
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
3921 Academy Parkway North, NE
Albuquerque, NM 87109
United States
DUNS: 055145320
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Doug Taylor
 Project Investigator
 (505) 342-4428
 dtaylor@tplinc.com
Business Contact
 Harold Stoller
Title: President & CEO
Phone: (505) 342-4412
Email: hstoller@tplinc.com
Research Institution
N/A
Abstract

"Optical components are where electronics were 50 years ago in that devices are discrete. To advance optical networks and systems, low-cost integration of optical functions is necessary. Integrated optical systems will lower costs and increase performance,helping to achieve true optical computing. TPL proposes innovative processing to facilitate the integration of optical components. Chemical solution deposition (CSD), a wet-chemical technique capable of pure and homogeneous compositions, and laser direct writing provide tremendous flexibility for the design and fabrication of integrated optics. Based on work that developed optical waveguides in erbium-doped films, we will integrate an amplifier pump source with a patterned splitter. This innovative process will result in a single chip that willreplace complicated and bulky multi-part systems and other so-called integrated devices that are merely discrete components packaged into a single box. TPL will deposit optical materials from silica to erbium-doped fluoride glasses, pattern waveguides by laser direct writing, and combine a thin film laser source into a single device. Feasibility will be proven by measuring optical gain through the single chip device. TPL will team with LightPath Technologies and the University of Arizona. This work will advance proven TPL technologies to further the development of integrated optics. Single chip, amplified splitters are necessary for t

* Information listed above is at the time of submission. *

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