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Compact, High Power Capacitors Based on Moldable Nanocomposite Dielectrics
Title: VP Capacitance Products
Phone: (505) 342-4437
Email: kslenes@tplinc.com
Title: Marketing Coordinator
Phone: (505) 342-4439
Email: tmosman@tplinc.com
Future HPM systems will require compact power to facilitate integration on mobile platforms. Capacitors, used to construct these sources, will need to deliver high current and high voltage under repetition. In response this need, TPL has established unique capabilities in the area of dielectrics. Revolutionary materials, processes and designs have been identified for power sources with significant size reductions. The technology is based on novel nanocomposite formulations that can be reliably formed into capacitors of complex shape and efficiently scaled for system development. The objective this program is to demonstrate nanocomposite capacitors capable of >3.0 J/cc for Air Force applications. TPLs approach will address two critical performance aspects relative to energy density: dielectric constant and pulse life. Material and process refinements will be introduced with expectations for a capacitor dielectric possessing a constant of 100 and dielectric strength of >300 V/µm. Concurrently, detailed characterization and theoretical modeling will be used to define the capacitor failure mode under pulse conditions. Penn State University will facilitate investigation into space charge related failure modes and TPL will identify electo-mechanical related failure modes. Alternative designs and materials will be considered to address the relative impact of these failure modes on capacitor voltage ratings under life conditions. BENEFIT: Successful completion of the proposed program will benefit development in several defense related power conditioning, control electronics and directed energy systems. High energy electrical storage systems with reduced size and weight are required for applications including: high energy laser, high power microwave, electric armor, electric guns, electric launch, particle accelerators and ballistic missile applications.
* Information listed above is at the time of submission. *