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SBIR Phase I: An Innovative Method for Removing Resist from Wafers

Award Information

Agency:
National Science Foundation
Branch:
N/A
Award ID:
79531
Program Year/Program:
2006 / SBIR
Agency Tracking Number:
0611170
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Uncopiers, Inc.
910 Poyntz Ave Manhattan, KS 66502-0000
View profile »
Woman-Owned: Yes
Minority-Owned: Yes
HUBZone-Owned: Yes
 
Phase 1
Fiscal Year: 2006
Title: SBIR Phase I: An Innovative Method for Removing Resist from Wafers
Agency: NSF
Contract: 0611170
Award Amount: $100,000.00
 

Abstract:

This Small Business Innovation Research (SBIR) Phase I Project seeks to develop an innovative method for removing resist from semiconductor wafers. The Microcavitation Resist Remover will help enable the low-k integration critical to the next generation of faster chips. Microcavitation will be a mechanical removal process influenced by the mechanical properties of fracture rather than the chemical constitution of the resist. Resist stripping is a growing $3.7B market. The proposed Microcavitation Resist Remover and wafer cleaner succesfully overcomes a critical technological barrier facing the IC manufacturing industry today. Beyond the IC manufacturing industy, the Microcavitation Resist Remover will be critical in all areas where thin film removal is critical e.g., MEMS, PCB, optics, automotive (paint removal), and aerospace. More broadly, it will be an enabling technology for use in thin film processing. Microcavitation is a chemical free, environmentally friendly technology.

Principal Investigator:

Hang Ji
Dr
7852934917
hji@unicopiers.com

Business Contact:

Sameer I. Madanshetty
Dr
7855322609
sameer@ksu.edu
Small Business Information at Submission:

Uncopiers, Inc.
6923 Redbud Drive P O Box 219 Manhattan, KS 66505

EIN/Tax ID:
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No