High Temperature, High Power Density Electronic Devices
Agency / Branch:
DOD / NAVY
This SBIR project is proposed to develop a high-temperature and high power density power system based on SiC power modules. The entire system will be designed to operate up to 120C ~ 150C ambient temperature without active cooling and the SiC power modules will be developed for operations at even higher temperature (up to 250C) in case of air-cooling failure. Phase I will be concentrated on (i) design of SiC power switches and modules, (ii) fabrication of SiC power modules, (iii) high-temperature packaging of SiC power modules, (iv) inverter characterization of SiC power modules at room temperature and up to 250C as well as investigating SiC power device failure mode (in case of failure), (v) design of SiC high power motor control system and simulation and modeling to confirm the proposed design. In Phase II, the designed system will be built completely and tested against goals established in Phase I. A plan will be developed based on Phase II results for the design and manufacturing of a shipboard power system in the privately funded Phase III of commercialization development.
Small Business Information at Submission:
UNITED SILICON CARBIDE, INC.
New Brunswick Tech Center, 100 Jersey Ave.Bldg A New Brunswick, NJ 08901
Number of Employees: