An Official Website of the United States Government
Non-Hermetic Electronic Encapsulant Materials
- Small Business Information
-
Woman-Owned: NoMinority-Owned: NoHUBZone-Owned: No
- Phase 2
-
Fiscal Year: 2002Title: Non-Hermetic Electronic Encapsulant MaterialsAgency / Branch: DOD / ARMYContract: DAAH01-02-C-R010Award Amount: $728,935.00
Abstract:
The main objective will be to optimize the non-hermetic encapsulants that were developed and tested in the Phase I program. The Phase II research will result in an increase of the thermal stability so that these encapsulants will be capable ofwithstanding temperatures at the 600F level. Formulations, components concentrations, application and curing methods will be fine tuned. Among tests to be conducted will be moisture permeability, adhesion, thermal stability, thermal coefficientof expansion, thermal conductivity and physical properties. We will encapsulate a large number of electronic parts and our screening test results will be verified by our subcontractors and independent test laboratories. We will providematerials and process specifications for the innovative materials and process that will be developed during the proposed program. At the end of Phase II, UDC will provide a detailed report that will include all work performed, resultant data,specifications and a Phase III production plan.Small Business Information at Submission:Utility Development Corp.
112 Naylon Avenue Livingston, NJ 07039EIN/Tax ID: 222429539DUNS: N/ANumber of Employees:Woman-Owned: NoMinority-Owned: NoHUBZone-Owned: No
Award Information
|
Agency: Department of Defense |
Branch: Army |
Award ID: 52777 |
Program Year/Program: 2002 / SBIR |
|
Agency Tracking Number: A002-1479 |
Solicitation Year: N/A |
Solicitation Topic Code: N/A |
Solicitation Number: N/A |