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THERMAL CONDUCTIVITY, DIFFUSIVITY PROBE DEVELOPMENT

Award Information

Agency:
National Science Foundation
Branch:
N/A
Award ID:
11880
Program Year/Program:
1991 / SBIR
Agency Tracking Number:
11880
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Vatell Corp.
Po Box 66 Christiansburg, VA 24073
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Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 2
Fiscal Year: 1991
Title: THERMAL CONDUCTIVITY, DIFFUSIVITY PROBE DEVELOPMENT
Agency: NSF
Contract: N/A
Award Amount: $207,334.00
 

Abstract:

A NEW TYPE OF PROBE AND ASSOCIATED COMPUTING INSTRUMENT ARE PROPOSED FOR QUICKLY MEASURING THERMAL PROPERTIES OF SOLID MATERIALS. THE PROPOSED COMBINATION IS BASED ON A MINIATURE THIN FILM HEAT FLUX SENSOR RECENTLY DEVELOPED AT VIRGINIA TECH. THE NEW PROBE ENABLES THE THERMAL CONDUCTIVITY AND DIFFUSIVITY OF SOLID MATERIAL SPECIMENS TO BE MEASURED SIMPLY AND RAPIDLY. AT THE END OF THE PROBE WILL BE A HEAT FLUX SENSOR AND TWO THIN FILM THERMOCOUPLES, APPLIED TO IT BY A MASKED SPUTTERING PROCESS. TO MEASURE THE THERMAL PROPERTIES OF A MATERIAL SPECIMEN, THE PROBE AND SPECIMEN, INITIALLY AT DIFFERENT TEMPERATURES, WILL BE PLACED ABRUPTLY IN CLOSE THERMAL CONTACT BY A MECHANICAL REGISTRATION DEVICE. THE RESULTING FLOW OF HEAT AND THE RAPIDLY CHANGING SURFACE TEMPERATURES OF THE SPECIMEN WILL BE TRANSDUCED INTO TRANSIENT ELECTRICAL SIGNALS. THESEWILL BE MEASURED AND RECORDED AS FUNCTIONS OF TIME. A METHOD FOR COMPUTING THERMAL CONDUCTIVITY AND DIFFUSIVITY FROM THE SIGNALS WILL BE DEVELOPED. A PHASE II PLAN FOR DEVELOPING THE COMPUTING INSTRUMENT ITSELF IS OUTLINED.

Principal Investigator:

Lawrence W Langley
President
0

Business Contact:

Small Business Information at Submission:

Vatell Corp.
Po Box 66 Christiansburg, VA 24073

EIN/Tax ID:
DUNS: N/A
Number of Employees: N/A
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No