You are here

A RAPID PROTOTYPING ENVIRONMENT FOR PACKAGING AND OTHER TECHNOLOGY ISSUES

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: N/A
Agency Tracking Number: 13116
Amount: $498,741.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 1991
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
1100 Woodfield Rd - Ste 108
Schaumburg, IL 60173
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Sowmitri Swamy
 (708) 706-9300
Business Contact
Phone: () -
Research Institution
N/A
Abstract

THIS PROPOSAL PRESENTS IDEAS AND A PLAN OF NEW TECHNOLOGY DEVELOPMENT FOR ADDRESSING PACKAGING AND OTHER TECHNOLOGY ISSUES IN ELECTRONIC SYSTEM DESIGN. THE PROPOSED WORK HAS AS ITS OBJECTIVE, THE IMPLEMENTATION OF A RAPID PROTOTYPING ENVIRONMENT THAT CONSISTS OF A SET OF TOOLS SUPPORTING HARDWARE DESIGN MEETING SPECIFIC RELIABILITY, PACKAGING, AND PERFORMANCE CONSTRAINTS. IT SUPPORTS ADDING CHANGES, CHANGING MODULARITY, REUSE, ABSTRACTION, AND CONSTRAINT PROPAGATION, FEATURES THAT ARE NECESSARY IN ANY RAPID PROTOTYPEING ENVIRONMENT. THE PROPOSED ENVIRONMENT WILL BE BUILT AROUND A HIERARCHICAL GRAPHICAL TOOL THAT WILL BE USED TO DEVELOP LAYERS OF HARDWARE DESCRIPTIONS INVOLVING INTERCONNECT, PACKAGING, AND PERFORMANCE DATA.

* Information listed above is at the time of submission. *

US Flag An Official Website of the United States Government