IN-SITU COMPOSITES IN THE ALUMINUM NITRIDE-ALUMINA SYSTEM
Agency / Branch:
DOD / MDA
Aluminum nitride (AlN), an electronic substrate material, is a promising ceramic for high-temperature structural applications. The self-reinforced AlN to be developed in this project will have room-temperature properties of 1000 MPa flexural strength and 7 to 8 MPa.m 1/2 fracture toughness. The composite will be free of glassy grain boundary phases. It will, therefore, have superior high-temperature mechanical properties, in-particular, creep resistance. Starting-powder characteristics, sintering-aid type and amount, sintering parameters including isothermal holding time and temperature, and furnace atmosphere will be systematically evaluated too achieve self-reinforcing microstructures. Scanning electron microscopy and light microscopy will be used to evaluate microstructural evolution.
Small Business Information at Submission:
Principal Investigator:Ender Savrun, Phd
Waterjet Technology, Inc.
21414 68th Avenue South Kent, WA 98032
Number of Employees: