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Very High Thermal Conductivity Micro-Filaments

Award Information

Agency:
Department of Defense
Branch:
Missile Defense Agency
Award ID:
18009
Program Year/Program:
1992 / SBIR
Agency Tracking Number:
18009
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Xemet, Inc.
15257 N.e. 90th Street Redmon, WA 98052
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Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 1
Fiscal Year: 1992
Title: Very High Thermal Conductivity Micro-Filaments
Agency / Branch: DOD / MDA
Contract: N/A
Award Amount: $64,825.00
 

Abstract:

Electronic cooling, micro-chip cooling and advanced materials all suffer from thermal limitations. XEMET micro-filaments used individually or embedded into matrix materials will create new families of products focused on these high-value-added markets. For electronic applications a single XEMET micro-filament 50 microns in diameter is capable of carrying 10 to 20 watts. Embedded into a matrix, they will remove 4 TO 10 times the heat loads limiting wafer scale applications. Formed into MMC's for high temperature advanced materials applications, they will carry in excess of 100 watts each, allowing structural materials to operate in environments which exceed their melting point.

Principal Investigator:

Richard B. Minch
2068812797

Business Contact:

Small Business Information at Submission:

Xemet, Inc.
15257 N.e. 90th St. Redmond, WA 98052

EIN/Tax ID:
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No