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Company Information:

Company Name:
POLAR MAGNETICS CORP.
Address:
5505 Castle Manor Drive
San Jose, CA 95129
Phone:
(405) 255-8345
URL:
N/A
EIN:
141841461
DUNS:
118503080
Number of Employees:
2
Woman-Owned?:
No
Minority-Owned?:
No
HUBZone-Owned?:
No

Commercialization:

Has been acquired/merged with?:
N/A
Has had Spin-off?:
N/A
Has Had IPO?:
N/A
Year of IPO:
N/A
Has Patents?:
N/A
Number of Patents:
N/A
Total Sales to Date $:
$ 0.00
Total Investment to Date $
$ 0.00
POC Title:
N/A
POC Name:
N/A
POC Phone:
N/A
POC Email:
N/A
Narrative:
N/A

Award Totals:

Program/Phase Award Amount ($) Number of Awards
SBIR Phase I $134,776.00 3
SBIR Phase II $748,000.00 1

Award List:

N/A

Award Year / Program / Phase:
2000 / SBIR / Phase I
Award Amount:
$64,944.00
Agency / Branch:
DOD / MDA
Principal Investigator:
Gary Bush, Chief Engineer
Abstract:
N/a

IHOP magnetic Drive Compressor

Award Year / Program / Phase:
2003 / SBIR / Phase I
Award Amount:
$0.00
Agency / Branch:
DOD / MDA
Principal Investigator:
Dale Dickinson, Principle Investigator
Abstract:
The Phase II proposal is to develop a novel magnetic drive compressor featuring an extended life bellows compressor . The bellows is driven by a highly coupled magnet system with a moving magnet and stationary yoke. The magnet is attached rigidly to thebellows system. The main advantages of the… More

IHOP magnetic Drive Compressor

Award Year / Program / Phase:
2003 / SBIR / Phase II
Award Amount:
$748,000.00
Agency / Branch:
DOD / MDA
Principal Investigator:
Dale Dickinson, Principle Investigator
Abstract:
The Phase II proposal is to develop a novel magnetic drive compressor featuring an extended life bellows compressor . The bellows is driven by a highly coupled magnet system with a moving magnet and stationary yoke. The magnet is attached rigidly to thebellows system. The main advantages of the… More

Reduced Emission Magnetic IC (REMIC) Packaging Material

Award Year / Program / Phase:
2003 / SBIR / Phase I
Award Amount:
$69,832.00
Agency / Branch:
DOD / MDA
Principal Investigator:
Abstract:
The need for new IC package system to reduce RF emissions and to enhance thermal conductivity require the developmnet of new materials. These materials are designed from an RF standpoint with additives to reduce thickness and weight while promoting thermaldissipation. A study of the properties of… More