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Flip Chip Bonding Technology Development for Multi-Chip Modules with…

Award Information

Agency:
Department of Defense 		Branch:
Navy 		Award ID:
 Program Year/Program:
2009 / STTR
Agency Tracking Number:
N074-018-0350 		Solicitation Year:
2007 		Solicitation Topic Code:
N07-T018 		Solicitation Number:
2007.
Small Business Information
HYPRES. Inc.
175 Clearbrook Road Elmsford, NY -
View profile »
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 2
Fiscal Year: 2009
Title: Flip Chip Bonding Technology Development for Multi-Chip Modules with Superconducting Integrated Circuits
Agency / Branch: DOD / NAVY
Contract: N00014-09-C-0687
Award Amount: $747,159.00
 

Abstract:

HYPRES in collaboration with Stony Brook University proposes to develop flip-chip bonding technology for assembling up to 4-chip MCMs operating at cryogenic temperatures. This will address the critical area of the MCM technology development and transition to full commercialization of the superconductor MCM technology for DoD and commercial satellite and wireless communications markets. The ultimate goal of this Phase II STTR is to develop a manufacturable process of bonding and assembling multiple superconducting and mixed-technology (hybrid) chips into multi-chip modules with data transfer rates between the chips in excess of 100 Gb/s.

Principal Investigator:

Sergey Topygo
(914) 592-1190
stolpygo@hypres.com

Business Contact:

Edward Kulinski
VP Finance
(914) 592-1190
ekulinski@hypres.com
Small Business Information at Submission:

HYPRES. Inc.
175 Clearbrook Road Elmsford, NY -

EIN/Tax ID: 13-3170343
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
Research Institution Information:
Stony Brook University
2540 Dole Street
Hall 402
Honolulu, HI 96822-
Contact: Lydia Chabza
Contact Phone: (631) 632-4849