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Massively Parallel High Temperature Probe System for Wafer-level Reliability…

Award Information

Agency:
Department of Commerce
Branch:
National Institute of Standards and Technology
Award ID:
Program Year/Program:
2011 / SBIR
Agency Tracking Number:
103-68-2011
Solicitation Year:
2010
Solicitation Topic Code:
9.10.02.1-R
Solicitation Number:
N/A
Small Business Information
Celadon Systems Inc.
14763 Energy Way Apple Valley, MN 55124
View profile »
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 2
Fiscal Year: 2011
Title: Massively Parallel High Temperature Probe System for Wafer-level Reliability Testing
Agency / Branch: DOC / NIST
Contract: SB1341-11-CN-0094
Award Amount: $300,000.00
 

Abstract:

Historical methods of reliability assessment are less and less effective as device sizes shrink. Larger sample sizes and longer duration tests are increasingly needed. At the same time, efforts to continue scaling semiconductors to ever smaller geometries is leading to an explosion of new device structures, materials and processes. The cost of testing these innovations is becoming a major barrier to their commercialization. The NIST Phase 1 project demonstrated that existing reliability test systems cannot reduce the cost of test significantly for these long duration tests, but concluded that a tightly integrated system offers the potential for a 10-fold reduction in test costs. However, a tightly integrated system introduces risks and unknowns due to the thermal, mechanical and electrical interaction of system components. The objective of this Phase 2 effort is to explore interactions between a broad range of feasible alternative identified in Phase 1 and develop the best possible combination into an integrated system.

Principal Investigator:

Jon Dunklee
(503) 505-0247
Small Business Information at Submission:

Celadon Systems Inc.
14763 Energy Way Apple Valley, MN 55124-5762

EIN/Tax ID: 411840697
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No