USA flag logo/image

An Official Website of the United States Government

High-Speed, Low-Power ADC for Digital Beam Forming (DBF) Systems

Award Information

Agency:
National Aeronautics and Space Administration
Branch:
N/A
Award ID:
Program Year/Program:
2011 / SBIR
Agency Tracking Number:
094089
Solicitation Year:
2009
Solicitation Topic Code:
S1.02
Solicitation Number:
Small Business Information
Ridgetop Group, Inc.
3580 West Ina Road Tucson, AZ -
View profile »
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 2
Fiscal Year: 2011
Title: High-Speed, Low-Power ADC for Digital Beam Forming (DBF) Systems
Agency: NASA
Contract: NNX11CB14C
Award Amount: $599,934.00
 

Abstract:

In Phase 1, Ridgetop Group designed a high-speed, yet low-power silicon germanium (SiGe)-based, analog-to-digital converter (ADC) to be a key element for digital beam forming (DBF) systems that will be used in NASA's future radar applications. The ADC will employ a novel combination of time interleaving, high-speed silicon-germanium BiCMOS technology and low-power techniques, such as the double-sampling technique, providing exceptional sampling speed of 500 MSPS, 1.5 GHz analog bandwidth,12 bits of resolution, and below 500 mW power dissipation, exceeding NASA's requirements.Ordinarily, ADC design requires large trade-offs in speed, resolution, and power consumption. The significance of this innovation is that it simultaneously provides a high-speed, high-resolution, and low-power ADC that is well ahead of the state of the art. These three characteristics are needed for DBF systems that contain large ADC arrays. The power consumption of existing ADC chips prohibits implementation of large DBF arrays in space. Ridgetop's innovative design leverages newer semiconductor process technologies that combine silicon and germanium into a compound semiconductor.Ridgetop has identified two Phase 2 objectives, which are:1. Design, fabricate and characterize Test Chip 1 that contains critical ADC subcircuits.2. Design, fabricate and characterize Test Chip 2 that contains the complete radiation tolerant, digitally calibrated, time-interleaved ADC design.During Phase 1 Ridgetop identified the topologies for all of the circuit blocks that will be included on Test Chip 1 and Test Chip 2. Ridgetop has also completed transistor-level designs for the key components on these chips.Estimated TRL at beginning and end of Phase 2 contract: Begin 4; End 8.

Principal Investigator:

Justin Judkins
Principal Investigator
5207423300
justin.judkins@ridgetopgroup.com

Business Contact:

Milena Thompson
Business Official
5205203300
milena@ridgetop-group.com
Small Business Information at Submission:

Ridgetop Group, Inc.
3580 West Ina Road Tucson, AZ -

EIN/Tax ID: 860979220
DUNS: N/A
Number of Employees:
Woman-Owned: Yes
Minority-Owned: No
HUBZone-Owned: No