Robust, Thin Resistive Films
Current resistive thin films employed in composite aerospace applications include metal-sputtered films, carbon-loaded polymer films, and carbon inks. These films are often difficult to laminate and are not flexible enough to conform to complex geometries without creasing, cracking, and changing resistivity. The object of this Phase I program is to develop thin resistive carbon nanotube films capable of withstanding organic matrix composite manufacturing process stresses and associated handling requirements while still maintaining resistivity characteristics.
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