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Development of a high performance, cost effective GaN power amplifier packaging…

Award Information

Department of Defense
Award ID:
Program Year/Program:
2011 / SBIR
Agency Tracking Number:
Solicitation Year:
Solicitation Topic Code:
Solicitation Number:
Small Business Information
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
Phase 1
Fiscal Year: 2011
Title: Development of a high performance, cost effective GaN power amplifier packaging for transmit/receive modules
Agency: DOD
Contract: N00167-11-P-0367
Award Amount: $79,997.00


The basic building block for phased array radar systems is based on a transmit/receive module containing MMICs for control and amplification of both transmit and receive paths. The cost, performance, and reliability of these modules have been plagued due to limitations in power amplifier packaging designs. Currently, a cavity-mount approach is utilized that minimizes parasitics and reduces thermal resistance from the power amplifier to cold plate using a heat spreader insert. However, the materials and attach methods involved in this package are costly and limit the performance of each power amplifier. In this proposal, APEI, Inc. will leverage its previous research expertise to develop a high performance GaN power amplifier package consisting of low cost heat spreader and die attach materials. In addition, a new packaging scheme is proposed that can potentially reduce the junction temperature by one-third compared to current packaging techniques.

Principal Investigator:

Brandon Passmore
Sr. Packaging Engineer
(479) 443-5759

Business Contact:

Sharmila Mounce
Business Operations Manag
(479) 443-5759
Small Business Information at Submission:

Arkansas Power Electronics International, Inc.
535 W. Research Center Blvd., Suite 209 Fayetteville, AR -

EIN/Tax ID: 710810115
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No