Development of Complex Shock and Vibration Model and Reliability Prediction Tool for Pb-free Alloys
Knowledge of the potential failure mechanisms and their drivers provides a foundation to this proposal, which is designed to assess the impacts of the harsh environmental stresses on the various packaging technologies proposed. From this assessment, the DoD and their supply chain will have a clear understanding of how the transition to Pb-free electronic packaging may change the mean time between failure (MTBF) of the component, and have a clear delineation based on physical parameters when environmental conditions introduces too high of a risk of part failure.
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