Reliability Analysis and Prediction tool for Reballed BGAs in DoD Environments
Agency / Branch:
DOD / OSD
This Phase II SBIR is focused on expanding on the Phase I results regarding reballing Ball Grid Array (BGA) parts from tin-silver-copper (SAC305) solder to SnPb eutectic solder. Other solder alloys, printed wiring board surface finishes, the die-package impact, solder ball pitch, different size BGAs (ball count), and test methodologies will be examined to fully characterize this process. For the military, this is an excellent interim approach prior to wholesale adoption of Pb-free parts and processes. It is important to understand the reliability risks associated with the reballing procedure, particularly as it relates to thermal cycling, shock and vibration environments.
Small Business Information at Submission:
5110 Roanoke Place Suite 101 College Park, MD -
Number of Employees: