USA flag logo/image

An Official Website of the United States Government

Reliability Analysis and Prediction tool for Reballed BGAs in DoD Environments

Award Information

Agency:
Department of Defense
Branch:
Office of the Secretary of Defense
Award ID:
Program Year/Program:
2011 / SBIR
Agency Tracking Number:
N2-3472
Solicitation Year:
2008
Solicitation Topic Code:
OSD08-M01
Solicitation Number:
2008.3
Small Business Information
DfR Solutions
5110 Roanoke Place Suite 101 College Park, MD -
View profile »
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 2
Fiscal Year: 2011
Title: Reliability Analysis and Prediction tool for Reballed BGAs in DoD Environments
Agency / Branch: DOD / OSD
Contract: N68335-11-C-0273
Award Amount: $300,000.00
 

Abstract:

This Phase II SBIR is focused on expanding on the Phase I results regarding reballing Ball Grid Array (BGA) parts from tin-silver-copper (SAC305) solder to SnPb eutectic solder. Other solder alloys, printed wiring board surface finishes, the die-package impact, solder ball pitch, different size BGAs (ball count), and test methodologies will be examined to fully characterize this process. For the military, this is an excellent interim approach prior to wholesale adoption of Pb-free parts and processes. It is important to understand the reliability risks associated with the reballing procedure, particularly as it relates to thermal cycling, shock and vibration environments.

Principal Investigator:

Joelle Arnold
Member of the Technical S
(301) 474-0607
jarnold@dfrsolutions.com

Business Contact:

Craig Hillman
CEO
(301) 474-0607
chillman@dfrsolutions.com
Small Business Information at Submission:

DfR Solutions
5110 Roanoke Place Suite 101 College Park, MD -

EIN/Tax ID: 731710526
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No