A Conformal Packaging and Installation Technique for In Situ Sensors in Extreme Environments
ABSTRACT: Sporian Microsystems Inc. has spent the last several years developing polymer derived SiCN sensor and associated packaging technology for application temperatures up to 1350 & #61616;C, and demonstrated them in the combustion environments of a range of commercial burner rigs and aerospace turbine engines. Based on our expertise in high temperature materials and packaging processes, we propose to develop a conformal packaging and"stick on"installation strategy for high temperature conformal sensors. Phase I will primarily include fabrication of conformal substrates, evaluation of thick film metallization, die attach, high temperature electrical interconnection, coating/encapsulation, and identification of advanced installation approaches. Simple proof of principle packaging prototypes will be installed on conformal surfaces and key aspects of the performance up to 600 degrees C will be demonstrated. The ultimate goal of this proposed effort is to develop a genetic/standardized high temperature conformal packaging and installation technology for use in extreme aerospace environments, at temperatures ranging from -60 degrees C up to 1000oC, and accelerations levels up to 56600g. Such packaging should be easily installed with no permanent changes to the engine components or surfaces, and sufficiently small and conformal to avoid disrupting aerodynamic flows. The packaging should be widely adaptable for many conformal sensor technologies with future development effort. BENEFIT: Aero propulsion turbine engines, communally used in commercial and military jets and rotorcraft, would benefit significantly by having a non invasive, small mass, conformal, on engine component sensors allowing for visibility of the conditions of the turbine engine. To enable such sensors, novel packaging technologies must be developed to interface the sensor with the sensed environment and with engine control and health monitoring systems. The conditions in this application are harsh, and packaging must be able to withstand high temperatures, high pressures, fuel and exhaust. The packaging technologies described in this proposal would allow exactly that, allowing sensing directly from the point of interest within the engine. Commercial applications abound for the successful results of this proposal in commercial and military jet and helicopter aircraft engine industries, which are made up of companies such as Pratt & Whitney, Pratt & Whitney, GE, Honeywell and Rolls-Royce. Additional potential market areas include: marine propulsion, rail transport, rocketry, land based power generation turbines, downstream crude oil refining, oil shale conversion, and government and academic laboratories.
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Sporian Microsystems, Inc.
515 Courtney Way Suite B Lafayette, CO -
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