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Machine Tool Genome Project

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: HR0011-12-9-0003
Agency Tracking Number: 10SB2-0258
Amount: $745,572.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: SB102-005
Solicitation Number: 2010.2
Timeline
Solicitation Year: 2010
Award Year: 2012
Award Start Date (Proposal Award Date): 2011-08-09
Award End Date (Contract End Date): N/A
Small Business Information
889 South Rainbow Blvd. PMB 690
Las Vegas, NV -
United States
DUNS: 62-178-50
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Thomas Delio
 President
 (702) 869-0836
 tdelio@mfg-labs.com
Business Contact
 Thomas Delio
Title: President
Phone: (702) 869-0836
Email: tdelio@mfg-labs.com
Research Institution
 Stub
Abstract

The objective of this research is to enable pre-process milling parameter selection for"first part correct"production. In the proposed solution the Receptance Coupling Substructure Analysis (RCSA) approach will be used to couple the measured spindle-machine dynamics to models of the tool and holder and predict the assembly"s dynamic response. Given this information, frequency/time-domain algorithms are applied to select feasible spindle speed-depth of cut pairs that enable first part correct production. The development of an automated artifact will be coupled with this technology to speed measurement and data transmission of spindle-machine receptances for evaluation of machine productivity and repeatability. Given the tool point response, the process stability and surface location error (part errors caused by forced vibrations) will be determined to separate feasible and infeasible zones within the spindle speed-axial depth of cut domain. Once acceptable combinations are determined, they will be presented in a new user-friendly format, the Tool Dashboard, similar to an automotive dashboard display. Tool Dashboards will be customized for various applications to analyze the effect of different process parameter combinations on vibration behavior (chatter sensitivity and surface location error) and energy consumption.

* Information listed above is at the time of submission. *

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