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Company Information:

Company Name:
SCIENCETOMORROW, LLC
Address:
PO Box 7562
Woodbridge, VA
Phone:
(877) 203-7673
URL:
EIN:
264689787
DUNS:
829225791
Number of Employees:
4
Woman-Owned?:
No
Minority-Owned?:
No
HUBZone-Owned?:
No

Commercialization:

Has been acquired/merged with?:
N/A
Has had Spin-off?:
N/A
Has Had IPO?:
N/A
Year of IPO:
N/A
Has Patents?:
N/A
Number of Patents:
N/A
Total Sales to Date $:
$ 0.00
Total Investment to Date $
$ 0.00
POC Title:
N/A
POC Name:
N/A
POC Phone:
N/A
POC Email:
N/A
Narrative:
N/A

Award Totals:

Program/Phase Award Amount ($) Number of Awards
SBIR Phase I $334,664.00 3

Award List:

Direct Digital Secondary Electron Signal Acquisition Probe for Scanning Electron Microscope.

Award Year / Program / Phase:
2013 / SBIR / Phase I
Award Amount:
$155,000.00
Agency:
DOE
Principal Investigator:
Abstract:
Research is proposed to investigate the feasibility of applying recent advances in semiconductor technology to fabricate direct digital Quantitative Secondary Electron Detectors (QSED) for scanning electron microscopes (SEMs). If successful, commercial versions of the QSED would transform the… More

Rapid Fabrication of SiCf/SiC composite via Field Assisted Sintering Technique for Turbine Applications

Award Year / Program / Phase:
2013 / SBIR / Phase I
Award Amount:
$79,801.00
Agency / Branch:
DOD / NAVY
Principal Investigator:
Subhadarshi Nayak, CTO – (877) 203-7673
Abstract:
State-of-the-art manufacturing cost for SiC matrix composites CMC components is still very high due to long lead times despite of many research efforts. ScienceTomorrow, in collaboration with Applied Research Lab of Penn State University and its OEM partners, will investigate ceramic… More

BOND-M: Bond Observation and Non-Destructive Measurement Technique

Award Year / Program / Phase:
2013 / SBIR / Phase I
Award Amount:
$99,863.00
Agency / Branch:
DOD / DARPA
Principal Investigator:
Subhadarshi Nayak, Chief Technology Officer – (877) 203-7673
Abstract:
ScienceTomorrow proposes to develop a novel Bond Observation and Non-Destructive Measurement (BOND-M) technique for measuring bond strength of adhesively joined composites. BOND-M will employ high-intensity focused ultrasound stress waves directed at a small region within the adhesive layer to… More