Low Cost/High Performance TR Module Packaging Technologies
Nuvotronics proposes to develop low-cost/high performance module technology for application in next generation TR modules. A near-hermetic approach using a four-step sealing approach is used, along with additional cost-savings realized in module interconnects and use of COTS components. A goal of 50% cost savings over today"s module is proposed. Phase I will provide environmental testing of a high-power test article that demonstrates key aspects of our approach.
Small Business Information at Submission:
7586 Old Peppers Ferry Loop Radford, VA -
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